| NO | Test Type | Test name | Following Standard | analysis item |
|---|
| 1 | Electric Properties | Voltage Measuring Device | IPC-TM-650 2.5.7 | Dielectric Withstanding Voltage Test |
|---|
| 2 | High Resistance Meter | IPC-TM-650 2.6.3 | Insulation Resistance Test |
|---|
| 3 | TDR Test | NA | PCB impedance Test |
|---|
| 4 | SIR Test | IPC-TM- 650 2.6.3.3A
& IPC-TM-650 2.6.3E&
IPC-TM-650 2.6.14A | Surface Insulation Resistance,
Humidity Insulation Resistance Test,
Iron Migration test |
|---|
| 5 | Mechanical Properties | Peeling Test Instrument | IPC-TM-650 2.4.8.C | Peel Strength Test |
|---|
| 6 | S/M adhesion tape | IPC-TM-650 2.4.28. & IPC-6012A 3.8.2 | adhesion test |
|---|
| 7 | Chemical Properties | Cleanness Test Instrument | IPC-TM-650 2.3.25B | Ionic Contamination Test |
|---|
| 8 | Thermal Properties | Thermal Shock Instrument | IPC-TM-650 2.6.7.2 | Copper Plating Quality Test |
|---|
| 9 | High Temperature & Humidity Cycle Instrument | IPC-TM-650 2.6.7.2 IPC-6012A 3.11.8 | Aging Test |
|---|
| 10 | IST (Interconnect Stress Testing) | IPC-TM-650 2.6.26 | DC Current Induced Thermal Cycling Test |
|---|
| 11 | Solderability | Solderability Test | IPC-TM-650 2.3.25B | PCB Solderability Test |
|---|
| 12 | Thermal Stress Test | IPC-TM-650 2.6.8 | Quality of Plated-Through Holes Test |
|---|
| 13 | Else | SEM&EDX | N/A | Scanning and Element Analysis |
|---|
| 14 | DSC (Difference Scanning Calorimeter) | IPC-TM 650 2.4.25 | Glass Transition Temperature (Tg and △Tg) |
|---|
