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High Density Interconnection
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| 1+N+1 HDI Board | - Major Applications of PCB Products
Notebook Computer Mobile phone Global position system(GPS) PDA(Personal digital assistant) Ultra-mobile Personal computer(UMPC) Digital Still Camera Wireless Modules
| - Product Properties
Layer Count:1+N+1 Thickness:0.8mm~1.6mm Laminate:FR-4 Min Mechanically Drilling Hole:0.2mm Min Laser Drilling Hole:0.1mm Solder Mask Color: Green,Blue,Yellow,etc. Surface Finish: OSP, Immersion silver, ENIG
| | 2+N+2 HDI Board | - Major Applications of PCB Products
Mobile phone PDA(Personal digital assistant) Global position system(GPS) Wireless Modules Smart Phone ……
| - Product Properties
Layer Count:2+N+2 Thickness:0.8mm~1.6mm Laminate:FR-4 Min Mechanically Drilling Hole:0.2mm Min Laser Drilling Hole:0.1mm Solder Mask Color: Green, Blue, Yellow, etc. Surface Finish: OSP, Immersion silver, ENIG
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