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Capability and Roadmap
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| Character |
2011 |
| Capability(Regular) |
Normal |
Limit |
| Layer Count |
4~12 |
2~14 |
| Thickness |
1.2~1.6mm |
0.8~1.6mm |
| Material |
FR4 |
Tg150/Tg170
Tg150 HF/Tg170 HF |
Tg150/Tg170
Tg150 HF/Tg170 HF |
| Min Core |
4mil |
3mil |
| Max Core |
62mil |
62mil |
| Copper |
Internal |
1/2oz,1oz |
1/2oz,1oz,2oz(P/G only) |
| External |
1/2oz |
1/2oz,1oz |
| Pattern |
Min L/S |
4mil/4mil |
3mil/3mil |
| VIA |
Min Hole |
10mil |
8mil |
| Min Pad |
20mil |
16mil |
| Aspect Ratio |
5 |
6 |
| Min Ring |
5mil |
4mil |
| Solder Mask |
Color |
Green/Blue |
Green/Blue
Red/Yellow/Black |
| Min Web |
3mil |
2.5mil/6mil(Black) |
| Min Clearance |
2.5mil |
1.5mil |
| Min Coverage |
3.5mil |
2.5mil |
| Legend |
Color |
White |
White/Yellow/Black |
| Min Width |
6mil |
4mil/6mil(Black) |
| Matel Finished |
OSP/Immersion Silver
ENIG/ENIG+OSP
Hard Gold Plating |
OSP/Immersion Silver
ENIG/ENIG+OSP
Hard Gold Plating |
Registration
(Min Space between PTH & Pattern) |
8mil |
7mil |
| Tolerance |
Impedance |
±10% |
±10% |
| Dimention |
±5mil |
±5mil |
| Hole |
PTH±3mil/NPTH±2mil |
PTH±2mil/NPTH±2mil |
| Character |
2011 |
| Capability(HLC-High Layer Count) |
Normal |
Limit |
| Layer Count |
6~14 |
6~18 |
| Thickness |
1.2~2.4mm |
1.0~3.2mm |
| Material |
FR-4 |
Tg150/Tg170
Tg150 HF/Tg170 HF |
Tg150/Tg170
Tg150 HF/Tg170 HF
Low Dk(Df) |
| Min Core |
4mil |
3mil |
| Max Core |
47mil |
47mil |
| Copper |
Internal |
1/2oz,1oz,2oz(P/G only) |
1/2oz,1oz,2oz |
| External |
1/2oz,1oz |
1/2oz,1oz |
| Pattern |
Min L/S |
4mil/4mil |
3mil/3mil |
| VIA |
Min Hole |
10mil |
8mil |
| Min Pad |
20mil |
18mil |
| Aspect Ratio |
6 |
10 |
| Min Ring |
5mil |
5mil |
| Solder Mask |
Color |
Green/Blue |
Green/Blue
Red/Yellow/Black |
| Min Web |
3mil |
2.5mil/6mil(Black) |
| Min Clearance |
2.5mil |
2mil |
| Min Coverage |
3.5mil |
3mil |
| Legend |
Color |
White |
White/Yellow/Black |
| Min Width |
6mil |
4mil/6mil(Black) |
| Matel Finished |
OSP/Immersion Silver
ENIG/ENIG+OSP
Hard Gold Plating |
OSP/Immersion Silver
ENIG/ENIG+OSP
Hard Gold Plating
LF HASL |
Registration
(Min Space between PTH & Pattern) |
8mil |
6mil |
Registration For Reliability
(Min Space between PTH & Pattern) |
10mil |
8mil |
| Tolerance |
Impedance |
±10% |
±8% |
| Dimention |
±5mil |
±5mil |
| Hole |
PTH±3mil/NPTH±2mil |
PTH±2mil/NPTH±2mil |
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