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發展方向及製程能力

高密度互連印刷電路板  

多層印刷電路板

Character 2011
Capability(Regular) Normal Limit
Layer Count 4~12 2~14
Thickness 1.2~1.6mm 0.8~1.6mm
Material FR4 Tg150/Tg170
Tg150 HF/Tg170 HF
Tg150/Tg170
Tg150 HF/Tg170 HF
Min Core 4mil 3mil
Max Core 62mil 62mil
Copper Internal 1/2oz,1oz 1/2oz,1oz,2oz(P/G only)
External 1/2oz 1/2oz,1oz
Pattern Min L/S 4mil/4mil 3mil/3mil
VIA Min Hole 10mil 8mil
Min Pad 20mil 16mil
Aspect Ratio 5 6
Min Ring 5mil 4mil
Solder Mask Color Green/Blue Green/Blue
Red/Yellow/Black
Min Web 3mil 2.5mil/6mil(Black)
Min Clearance 2.5mil 1.5mil
Min Coverage 3.5mil 2.5mil
Legend Color White White/Yellow/Black
Min Width 6mil 4mil/6mil(Black)
Matel Finished OSP/Immersion Silver
ENIG/ENIG+OSP
Hard Gold Plating
OSP/Immersion Silver
ENIG/ENIG+OSP
Hard Gold Plating
Registration
(Min Space between PTH & Pattern)
8mil 7mil
Tolerance Impedance ±10% ±10%
Dimention ±5mil ±5mil
Hole PTH±3mil/NPTH±2mil PTH±2mil/NPTH±2mil

Character 2011
Capability(HLC-High Layer Count) Normal Limit
Layer Count 6~14 6~18
Thickness 1.2~2.4mm 1.0~3.2mm
Material FR-4 Tg150/Tg170
Tg150 HF/Tg170 HF
Tg150/Tg170
Tg150 HF/Tg170 HF
Low Dk(Df)
Min Core 4mil 3mil
Max Core 47mil 47mil
Copper Internal 1/2oz,1oz,2oz(P/G only) 1/2oz,1oz,2oz
External 1/2oz,1oz 1/2oz,1oz
Pattern Min L/S 4mil/4mil 3mil/3mil
VIA Min Hole 10mil 8mil
Min Pad 20mil 18mil
Aspect Ratio 6 10
Min Ring 5mil 5mil
Solder Mask Color Green/Blue Green/Blue
Red/Yellow/Black
Min Web 3mil 2.5mil/6mil(Black)
Min Clearance 2.5mil 2mil
Min Coverage 3.5mil 3mil
Legend Color White White/Yellow/Black
Min Width 6mil 4mil/6mil(Black)
Matel Finished OSP/Immersion Silver
ENIG/ENIG+OSP
Hard Gold Plating
OSP/Immersion Silver
ENIG/ENIG+OSP
Hard Gold Plating
LF HASL
Registration
(Min Space between PTH & Pattern)
8mil 6mil
Registration For Reliability
(Min Space between PTH & Pattern)
10mil 8mil
Tolerance Impedance ±10% ±8%
Dimention ±5mil ±5mil
Hole PTH±3mil/NPTH±2mil PTH±2mil/NPTH±2mil
COPYRIGHT 2007 HannStar Board International Holdings Ltd. ALL RIGHTS RESERVED 蘇ICP備14058853號